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Portabel Harness Crimp Cross-section Analysis System WPM-SES
Portabel Harness Crimp Cross-section Analysis System WPM-SES Portabel Harness Crimp Cross-section Analysis System WPM-SES Portabel Harness Crimp Cross-section Analysis System WPM-SES
  • Portabel Harness Crimp Cross-section Analysis System WPM-SES

  • Model No: WPM-SES

  • Harness Crimp Cross-section Analysis System
    Control System Adopt Japanese Mitsubishi PLC controller - SBL
    Module cut range 0.13 ~6.00 mm2
    Rotate speed 2800 rpm (Imported motor from Germany)
    Cut speed 2 mm / sec
    Cut wheel inner diameter 21.7 mm, OD:105 mm, thickness: 0.5 mm (Germany imported, delicate and durable)
    Module grind speed 2800 rpm (Imported motor from Germany)
    Z-axis slightly tuning range 0.00~5.00 mm
    Special sandpaper OD 100 mm
    X-axis shift Japanese Panasonic servo motor
    Eclipse partial electrolysis Up to 6 mm2
    Electrolysis time 5~30 sec
    Picture ingestion High quality, low distortion optical instrument with 10x eyepiece
    Amplify multiple 0.75x, 1x, 1.5x, 2.0x, 2.5x, 3.0x, 3.5x, 4.0x, 4.5x, 5.0x(0.5 stuck position shift technology)
    Tooth pitch multiple 0.75x, 1x, 1.5x, 2.0x, 2.5x, 3.0x, 3.5x, 4.0x, 4.5x, 5.0x(0.5 stuck position shift technology)
    Observation range 1.2~8.2 mm

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Detailed description

Cross-section Harness Crimp Cross-section Analysis System 
The Crimp Cross-sectional Analysis System is composed of cutting and grinding integrated equipment, optical sampling, corrosion cleaning, cross-section image acquisition system, wire harness terminal picture measurement, and analysis system imported from Japan.
Quick sample making and monitoring can be done with our crimp cross-section analysis system.
The ergonomic design and modular combination make the operation more convenient and fast.  
The processing and analysis of one terminal can be completed within 5 minutes, which greatly improves the speed of terminal cross-section quality inspection.
The operation is simple, convenient, and fast. It adopts Japan's high-definition image acquisition system and ensures accurate measurement analysis to protect your production.
High-performance microscopes and special software can measure the length and calculate area simply and correctly.
When observing objects in ultra-high definition, it can generate upright three-dimensional spatial images with strong stereoscopic sense, clear imaging, and clear and wide imaging.
Control System:  Adopt Japanese Mitsubishi PLC controller - SBL
Module cut range:  0.13 ~6.00 mm2
Rotate speed:  2800 rpm (Imported motor from Germany)
Cut speed:  2 mm / sec
Cut wheel inner diameter:  21.7 mm, OD:105 mm, thickness: 0.5 mm (Germany imported, delicate and durable)
Module grind speed:  2800 rpm (Imported motor from Germany)
Z-axis slightly tuning range:  0.00~5.00 mm
Special sandpaper OD:  100 mm
X-axis shift:  Japanese Panasonic servo motor
Eclipse partial electrolysis:  Up to 6 mm2
Electrolysis time:  5~30 sec
Picture ingestion:  High quality, low distortion optical instrument with 10x eyepiece
Amplify multiple:  0.75x, 1x, 1.5x, 2.0x, 2.5x, 3.0x, 3.5x, 4.0x, 4.5x, 5.0x(0.5 stuck position shift technology)
Tooth pitch multiple:  0.75x, 1x, 1.5x, 2.0x, 2.5x, 3.0x, 3.5x, 4.0x, 4.5x, 5.0x(0.5 stuck position shift technology)
Observation range:  1.2~8.2 mm(X-axis direction)
Observation feature 1:  Ultra-bright white LED light source can be controlled infinitely
Observation feature 2:  X Y Z-axis mobile platform with slightly tuning
Range:  +/- 6 mm(Three-dimensional)
Analysis and file record:  Japanese industrial HD video system 3-megapixel camera, USB 2.0, and Section-ms software
Tool certification:  
Enhanced measurement tools including compression ratios have been certified in the 
automotive/home appliance/IT industry
Voltage and watt:  220VAC, 50Hz, 300W
Weight:  30kg
Dimensions:  490 mm (L) x 340 mm (W) x 340 mm (H)



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